Price: $200.00 - $155.73
(as of Nov 24,2024 04:55:52 UTC – Details)

Publisher ‏ : ‎ CRC Press; 1st edition (June 28, 2024)
Language ‏ : ‎ English
Hardcover ‏ : ‎ 448 pages
ISBN-10 ‏ : ‎ 1032528230
ISBN-13 ‏ : ‎ 978-1032528236
Item Weight ‏ : ‎ 1.81 pounds
Dimensions ‏ : ‎ 6.14 x 1 x 9.21 inches

Direct Copper Interconnection for Advanced Semiconductor Technology

In the world of advanced semiconductor technology, direct copper interconnection has emerged as a game-changing innovation. This revolutionary method of connecting copper wires directly to semiconductor devices has paved the way for faster, more efficient electronic devices.

By eliminating the need for traditional bonding wires, direct copper interconnection reduces signal delays and improves overall performance. This technology also enables higher density packaging, allowing for more components to be packed into a smaller space.

Direct copper interconnection has been widely adopted in the semiconductor industry, particularly in the production of high-performance computing devices, advanced smartphones, and other cutting-edge electronics.

As the demand for faster and more powerful devices continues to grow, direct copper interconnection is poised to play a crucial role in shaping the future of semiconductor technology. Its ability to enhance performance and efficiency make it a key technology to watch in the coming years.
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