Integrated Circuit Fabrication: Science and Technology


Price: $79.99
(as of Nov 25,2024 12:23:10 UTC – Details)




Publisher ‏ : ‎ Cambridge University Press; 1st edition (January 25, 2024)
Language ‏ : ‎ English
Hardcover ‏ : ‎ 700 pages
ISBN-10 ‏ : ‎ 1009303589
ISBN-13 ‏ : ‎ 978-1009303583
Item Weight ‏ : ‎ 3.9 pounds
Dimensions ‏ : ‎ 8.5 x 1.5 x 10.5 inches


Integrated Circuit Fabrication: Science and Technology

Integrated circuits are the backbone of modern technology, powering everything from smartphones to computers to medical devices. The process of creating these tiny electronic components is a complex and intricate one, requiring a deep understanding of both science and technology.

At its core, integrated circuit fabrication involves the creation of microscopic circuits on a silicon wafer. This process begins with the design of the circuit layout, which is then transferred onto the wafer using a process called photolithography. This involves shining ultraviolet light through a mask onto a light-sensitive material on the wafer, creating a pattern that defines the circuit.

Once the circuit layout is defined, various layers of materials are deposited onto the wafer using techniques such as chemical vapor deposition or sputtering. These layers are then etched away using techniques such as reactive ion etching or wet etching to create the desired circuit pattern.

Throughout this process, precise control over temperature, pressure, and chemical composition is essential to ensure the integrity of the circuit. Advanced technologies such as ion implantation and rapid thermal processing are used to further refine the properties of the circuit.

Overall, integrated circuit fabrication is a highly sophisticated process that requires a deep understanding of materials science, chemistry, physics, and engineering. As technology continues to advance, so too will the techniques used to create these vital components. The future of integrated circuit fabrication holds exciting possibilities for further miniaturization and increased performance, driving the next generation of technological innovation.
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