Semiconductor Processing 2: Wafers & Deposition (Semiconductor Processing Concepts)

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ASIN ‏ : ‎ B0BZ3MKHFS
Publication date ‏ : ‎ March 20, 2023
Language ‏ : ‎ English
File size ‏ : ‎ 2492 KB
Text-to-Speech ‏ : ‎ Enabled
Screen Reader ‏ : ‎ Supported
Enhanced typesetting ‏ : ‎ Enabled
X-Ray ‏ : ‎ Not Enabled
Word Wise ‏ : ‎ Not Enabled
Print length ‏ : ‎ 334 pages

Semiconductor Processing 2: Wafers & Deposition (Semiconductor Processing Concepts)

In our previous post, we discussed the basics of semiconductor processing, including lithography and etching. In this post, we will delve deeper into two crucial aspects of semiconductor manufacturing: wafers and deposition.

Wafers are the foundation of semiconductor devices. Typically made of silicon, wafers are sliced from a single crystal ingot and polished to a mirror-like finish. The most common wafer sizes are 200mm and 300mm in diameter, with larger wafers being more cost-effective due to higher yield per wafer.

Deposition is a key step in semiconductor processing, where thin films of material are deposited onto the wafer surface to create various layers within the device. There are several deposition techniques, including physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD), each offering unique advantages and limitations.

PVD involves the evaporation of a solid material, which condenses onto the wafer surface to form a thin film. CVD, on the other hand, relies on chemical reactions to deposit material onto the wafer. ALD is a precise deposition technique that involves alternating pulses of reactant gases to deposit thin, uniform layers with atomic-scale control.

Overall, wafers and deposition play a critical role in semiconductor processing, enabling the creation of complex semiconductor devices with high precision and reliability. Stay tuned for our next post, where we will explore more semiconductor processing concepts.
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