Zion Tech Group

Tag: 0.15mm

  • Amaoe Stencil Nand Flash EMMC EMCP UFS BGA Reballing Stencil 0.15mm

    Amaoe Stencil Nand Flash EMMC EMCP UFS BGA Reballing Stencil 0.15mm



    Amaoe Stencil Nand Flash EMMC EMCP UFS BGA Reballing Stencil 0.15mm

    Price : 11.29

    Ends on : N/A

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    Are you in need of a high-quality stencil for reballing BGA components? Look no further than the Amaoe Stencil Nand Flash EMMC EMCP UFS BGA Reballing Stencil 0.15mm. This precision stencil is perfect for reballing a variety of components, including Nand Flash, EMMC, EMCP, and UFS chips.

    With a thickness of just 0.15mm, this stencil allows for precise reballing of even the smallest components. The high-quality materials used in its construction ensure durability and longevity, making it a reliable tool for your reballing needs.

    Don’t settle for subpar stencils when it comes to reballing BGA components. Invest in the Amaoe Stencil Nand Flash EMMC EMCP UFS BGA Reballing Stencil 0.15mm and experience the difference in quality and performance.
    #Amaoe #Stencil #Nand #Flash #EMMC #EMCP #UFS #BGA #Reballing #Stencil #0.15mm, NAND flash

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