Tag: Bandgap

Price: $215.00 – $23.84
(as of Dec 16,2024 02:00:02 UTC – Details)

Publisher ‏ : ‎ Woodhead Publishing; 1st edition (June 13, 2018)
Language ‏ : ‎ English
Paperback ‏ : ‎ 240 pages
ISBN-10 ‏ : ‎ 0081020945
ISBN-13 ‏ : ‎ 978-0081020944
Item Weight ‏ : ‎ 11.5 ounces
Dimensions ‏ : ‎ 5.98 x 0.55 x 9.02 inches

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)

In the world of power electronics, wide bandgap (WBG) materials such as silicon carbide (SiC) and gallium nitride (GaN) are revolutionizing the industry with their superior performance and efficiency. However, the successful implementation of WBG power semiconductors relies heavily on the packaging materials and components used.

This book, part of the Woodhead Publishing Series in Electronic and Optical Materials, delves into the critical aspects of packaging WBG power semiconductors. From the materials used in packaging to the design and reliability considerations, this comprehensive guide covers everything you need to know about effectively packaging WBG power devices.

Key topics covered in this book include:

– Overview of wide bandgap power semiconductor materials
– Packaging materials and technologies for WBG power devices
– Reliability testing and failure mechanisms in WBG power semiconductor packaging
– Thermal management strategies for WBG power devices
– Advanced packaging techniques for WBG power semiconductors

Whether you are a researcher, engineer, or student in the field of power electronics, this book is a must-read for anyone looking to understand the intricacies of packaging wide bandgap power semiconductors. Stay ahead of the curve and learn how to effectively package and deploy WBG power devices for optimal performance and reliability.
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